Heat transfer between integrated sensor-lens assemblies in an image capture device

ABSTRACT

An image capture device is disclosed that includes: a body; first and second image capture devices supported within the body so as to define respective, overlapping first and second fields-of-view; and a thermal spreader. The first image capture device includes a first integrated sensor-lens assembly (ISLA) with a first image sensor and a first lens, and the second image capture device includes a second ISLA with a second image sensor and a second lens. The first lens faces in a first direction, and is positioned to receive and direct light onto the first image sensor, and the second lens faces in a second direction, and is positioned to receive and direct light onto the second image sensor, wherein the second direction is generally opposite to the first direction. The thermal spreader extends between, and is connected to, the first and second ISLAs, and is configured to transfer heat therebetween.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/398,369, filed Apr. 30, 2019, the contents of which is incorporatedby reference in its entirety.

TECHNICAL FIELD

The present disclosure relates generally to image capture devices, and,more specifically, to transferring heat between integrated sensor-lensassemblies (ISLAs) in an image capture device.

BACKGROUND

Image capture devices take a variety of forms and find wideapplicability in handheld cameras and video recorders, cell phones,drones, and vehicles. These devices capture, focus, and convert lightinto an electronic image signal using an optical module that typicallyincludes one or more integrated sensor-lens assemblies (ISLAs). Duringoperation, however, the ISLAs generate heat that must be efficientlymanaged, which is conventionally done by transferring heat directly fromthe ISLAs to one or more heat sinks.

The present disclosure discusses various advancements in the managementof heat generated during the operation of image capture devices. Inparticular, the present disclosure describes the transfer of heatbetween ISLAs such that the ISLAs can themselves serve as additionalheat sinks when inactive.

SUMMARY

In one aspect of the present disclosure, a device is disclosed thatincludes: a body; a first image capture device supported within the bodyand defining a first field-of-view; a second image capture devicesupported within the body and defining a second field-of-view thatoverlaps the first field-of-view; and a thermal spreader. The firstimage capture device includes a first integrated sensor-lens assembly(ISLA) with a first image sensor and a first lens, and the second imagecapture device includes a second ISLA with a second image sensor and asecond lens. The first lens faces in a first direction, and ispositioned to receive and direct light onto the first image sensor, andthe second lens faces in a second direction, and is positioned toreceive and direct light onto the second image sensor, wherein thesecond direction is generally opposite to the first direction. Thethermal spreader is connected to, and extends between, the first andsecond ISLAs, and is configured to transfer heat therebetween.

In certain embodiments, the image capture device may be configured foroperation in a first mode, during which, the first and second imagesensors are each active such that images are capturable by each of thefirst and second image capture devices, and a second mode, during which,only one of the first and second image sensors is active such thatimages are capturable by only one of the first and second image capturedevices.

In certain embodiments, the first ISLA may further include a firstprinted circuit board supporting the first image sensor and including afirst conductive overlay, and the second ISLA may further include asecond printed circuit board supporting the second image sensor andincluding a second conductive overlay. In such embodiments, the thermalspreader may be connected to the first and second conductive overlays(rather than to the first and second image sensors themselves).

In certain embodiments, the thermal spreader may be unitary inconstruction.

In certain embodiments, the thermal spreader may include (e.g., may beformed partially or entirely from) graphite.

In certain embodiments, the thermal spreader may define a maximum widththat lies substantially within the range of approximately 15 mm toapproximately 25 mm.

In certain embodiments, the thermal spreader may define a maximumthickness that lies substantially within the range of approximately 0.05mm to approximately 0.1 mm.

In certain embodiments, the image capture device may further include aheat sink. In such embodiments, the thermal spreader may includeopposing first and second end portions that are connected to the heatsink.

In certain embodiments, the thermal spreader may include an intermediateportion that extends between the first and second end portions, whereinthe intermediate portion is connected to the first and second imagesensors.

In certain embodiments, the thermal spreader may be non-linear inconfiguration. For example, the thermal spreader may define a firstelbow that is positioned adjacent to the first image sensor, a secondelbow that is positioned between the first image sensor and the secondimage sensor, and a third elbow that is positioned adjacent to thesecond image sensor.

In another aspect of the present disclosure, an optical module for animage capture device is disclosed. The optical module includes: a firstintegrated sensor-lens assembly (ISLA) with a first image sensor and afirst lens; a second integrated sensor-lens assembly (ISLA) with asecond image sensor and a second lens; and a bridge that is connected tothe first ISLA and to the second ISLA. The bridge includes a thermallyconductive material to facilitate heat transfer between the first ISLAand the second ISLA.

In certain embodiments, the first ISLA may define a first field-of-view,and the second ISLA may define a second field-of-view that overlaps thefirst field-of-view.

In certain embodiments, the bridge may be unitary in construction.

In certain embodiments, the bridge may include (e.g., may be formedpartially or entirely from) graphite.

In certain embodiments, the bridge may define a maximum width that liessubstantially within the range of approximately 15 mm to approximately25 mm, and a maximum thickness that lies substantially within the rangeof approximately 0.05 mm to approximately 0.1 mm.

In certain embodiments, the bridge may include a tortuous configuration.For example, the bridge may define a first elbow that is positionedadjacent to the first ISLA, a second elbow that is positioned betweenthe first ISLA and the second ISLA, and a third elbow that is positionedadjacent to the second ISLA.

In another aspect of the present disclosure, a method of assembling anoptical module for an image capture device is disclosed. The methodincludes: connecting opposite first and second end portions of a thermalbridge to a heat sink; and connecting an intermediate portion of thethermal bridge (i.e., a portion of the thermal bridge that extendsbetween the first and second end portions) to a first integratedsensor-lens assembly (ISLA) and to a second ISLA such that the thermalbridge extends between the first and second ISLAs to thermally connectthe first and second ISLAs and facilitate heat transfer therebetween.

In certain embodiments, the method may further include orienting thefirst ISLA such that a lens of the first ISLA faces in a firstdirection, and orienting the second ISLA such that a lens of the secondISLA faces in a second direction generally opposite to the firstdirection, whereby a first field-of-view defined by the first ISLAoverlaps a second field-of-view defined by the second ISLA.

In certain embodiments, connecting the intermediate portion of thethermal bridge to the first ISLA and to the second ISLA may includepositioning the thermal bridge such that the intermediate portionextends, at least partially, in transverse relation to image sensors ofthe first and second ISLAs.

In certain embodiments, the thermal bridge may be unitary inconstruction.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying drawings. Itis emphasized that, according to common practice, the various featuresof the drawings are not to scale. On the contrary, the dimensions of thevarious features are arbitrarily expanded or reduced for clarity.

FIGS. 1A-D are isometric views of an example of an image capture device.

FIGS. 2A-B are isometric views of another example of an image capturedevice.

FIG. 2C is a cross-sectional view of the image capture device of FIGS.2A-B.

FIGS. 3A-B are block diagrams of examples of image capture systems.

FIG. 4 is a partial, front, perspective view of an optical module of theimage capture device seen in FIGS. 2A-B, which includes first and secondintegrated sensor-lens assemblies (ISLAs) that are connected by athermal spreader.

FIG. 5 is a partial, rear, perspective view of the optical module seenin FIG. 4.

FIG. 6 is a partial, front, perspective view of the optical module seenin FIG. 4 illustrating connection of the first and second ISLAs to aheat sink via a thermal spreader.

FIG. 7 is a partial, rear, perspective view of the optical module seenin FIG. 6.

FIG. 8 is a partial, front, perspective view of an alternate embodimentof the optical module in which the first and second ISLAs each include aconductive overlay.

FIG. 9 is a partial, rear, perspective view of the optical module seenin FIG. 8.

FIG. 10 is a partial, rear, perspective view of the optical module seenin FIG. 8, further including an intervening member (e.g., thermalpadding).

FIG. 11 is a partial, rear, perspective view of an alternate embodimentof the optical module in which the thermal spreader includes individualthermal bridges.

FIG. 12 is a partial, rear, perspective view of an alternate embodimentof the optical module seen in FIG. 11 in which the first and secondISLAs each include a conductive overlay.

DETAILED DESCRIPTION

The present disclosure describes image capture devices that include anoptical module with dual (first and second) ISLAs. The ISLAs areoriented in generally opposite directions (i.e., such that the ISLAs arerotated approximately 180° from each other), and include overlappingfields-of-view so as to support the capture and creation of not onlyindividual images, but spherical images as well.

In certain image capture devices, heat is transferred away from theISLAs by connecting the ISLAs to a heat sink via individual thermalbridges (or other such heat transfer members). The present disclosureimproves upon heat transfer in image capture devices by including asingle heat transfer member (e.g., a graphite thermal spreader orbridge) that is unitary in construction. The thermal spreader isconnected to, and extends between, the ISLAs, and includes opposing endportions that are connected to the heat sink in the image capturedevice. By connecting the ISLAs via the thermal spreader, bothphysically and thermally, heat generated by one of the ISLAs istransferrable to the other. For example, when the image capture deviceis being used to capture single (e.g., non-spherical) images and/orvideo, only a single ISLA is operating at any given time. During suchuse, heat can be transferred away from the operational ISLA to thenon-operational ISLA using the thermal spreader to increase run time ofthe image capture device, which is particularly advantageous during thecapture of higher-resolution (e.g., 4 k) image(s) and/or video.

FIGS. 1A-D are isometric views of an example of an image capture device100. The image capture device 100 may include a body 102 having a lens104 structured on a front surface of the body 102, various indicators onthe front surface of the body 102 (such as LEDs, displays, and thelike), various input mechanisms (such as buttons, switches, andtouchscreen mechanisms), and electronics (e.g., imaging electronics,power electronics, etc.) internal to the body 102 for capturing imagesvia the lens 104 and/or performing other functions. The image capturedevice 100 may be configured to capture images and video and to storecaptured images and video for subsequent display or playback.

The image capture device 100 may include various indicators, includingLED lights 106 and an LCD display 108. The image capture device 100 mayalso include buttons 110 configured to allow a user of the image capturedevice 100 to interact with the image capture device 100, to turn theimage capture device 100 on, to operate latches or hinges associatedwith doors of the image capture device 100, and/or to otherwiseconfigure the operating mode of the image capture device 100. The imagecapture device 100 may also include a microphone 112 configured toreceive and record audio signals in conjunction with recording video.

The image capture device 100 may include an I/O interface 114 (e.g.,hidden as indicated using dotted lines). As best shown in FIG. 1B, theI/O interface 114 can be covered and sealed by a removable door 115 ofthe image capture device 100. The removable door 115 can be secured, forexample, using a latch mechanism 115 a (e.g., hidden as indicated usingdotted lines) that is opened by engaging the associated button 110 asshown.

The removable door 115 can also be secured to the image capture device100 using a hinge mechanism 115 b, allowing the removable door 115 topivot between an open position allowing access to the I/O interface 114and a closed position blocking access to the I/O interface 114. Theremovable door 115 can also have a removed position (not shown) wherethe entire removable door 115 is separated from the image capture device100, that is, where both the latch mechanism 115 a and the hingemechanism 115 b allow the removable door 115 to be removed from theimage capture device 100.

The image capture device 100 may also include another microphone 116integrated into the body 102 or housing. The front surface of the imagecapture device 100 may include two drainage ports as part of a drainagechannel 118. The image capture device 100 may include an interactivedisplay 120 that allows for interaction with the image capture device100 while simultaneously displaying information on a surface of theimage capture device 100. As illustrated, the image capture device 100may include the lens 104 that is configured to receive light incidentupon the lens 104 and to direct received light onto an image sensorinternal to the lens 104.

The image capture device 100 of FIGS. 1A-D includes an exterior thatencompasses and protects internal electronics. In the present example,the exterior includes six surfaces (i.e., a front face, a left face, aright face, a back face, a top face, and a bottom face) that form arectangular cuboid. Furthermore, both the front and rear surfaces of theimage capture device 100 are rectangular. In other embodiments, theexterior may have a different shape. The image capture device 100 may bemade of a rigid material such as plastic, aluminum, steel, orfiberglass. The image capture device 100 may include features other thanthose described herein. For example, the image capture device 100 mayinclude additional buttons or different interface features, such asinterchangeable lenses, cold shoes and hot shoes that can add functionalfeatures to the image capture device 100, etc.

The image capture device 100 may include various types of image sensors,such as charge-coupled device (CCD) sensors, active pixel sensors (APS),complementary metal-oxide-semiconductor (CMOS) sensors, N-typemetal-oxide-semiconductor (NMOS) sensors, and/or any other image sensoror combination of image sensors.

Although not illustrated, in various embodiments, the image capturedevice 100 may include other additional electrical components (e.g., animage processor, camera SoC (system-on-chip), etc.), which may beincluded on one or more circuit boards within the body 102 of the imagecapture device 100.

The image capture device 100 may interface with or communicate with anexternal device, such as an external user interface device, via a wiredor wireless computing communication link (e.g., the I/O interface 114).The user interface device may, for example, be the personal computingdevice 360 described below with respect to FIG. 3B. Any number ofcomputing communication links may be used. The computing communicationlink may be a direct computing communication link or an indirectcomputing communication link, such as a link including another device ora network, such as the Internet, may be used.

In some implementations, the computing communication link may be a Wi-Filink, an infrared link, a Bluetooth (BT) link, a cellular link, a ZigBeelink, a near-field communications (NFC) link (such as an ISO/IEC 20643protocol link), an Advanced Network Technology interoperability (ANT+)link, and/or any other wireless communications link or combination oflinks.

In some implementations, the computing communication link may be an HDMIlink, a USB link, a digital video interface link, a display portinterface link (such as a Video Electronics Standards Association (VESA)digital display interface link), an Ethernet link, a Thunderbolt link,and/or other wired computing communication link.

The image capture device 100 may transmit images, such as panoramicimages, or portions thereof, to the user interface device (not shown)via the computing communication link, and the user interface device maystore, process, display, or a combination thereof the panoramic images.

The user interface device may be a computing device, such as asmartphone, a tablet computer, a phablet, a smart watch, a portablecomputer, and/or another device or combination of devices configured toreceive user input, communicate information with the image capturedevice 100 via the computing communication link, or receive user inputand communicate information with the image capture device 100 via thecomputing communication link.

The user interface device may display, or otherwise present, content,such as images or video, acquired by the image capture device 100. Forexample, a display of the user interface device may be a viewport intothe three-dimensional space represented by the panoramic images or videocaptured or created by the image capture device 100.

The user interface device may communicate information, such as metadata,to the image capture device 100. For example, the user interface devicemay send orientation information of the user interface device withrespect to a defined coordinate system to the image capture device 100,such that the image capture device 100 may determine an orientation ofthe user interface device relative to the image capture device 100.

Based on the determined orientation, the image capture device 100 mayidentify a portion of the panoramic images or video captured by theimage capture device 100 for the image capture device 100 to send to theuser interface device for presentation as the viewport. In someimplementations, based on the determined orientation, the image capturedevice 100 may determine the location of the user interface deviceand/or the dimensions for viewing of a portion of the panoramic imagesor video.

The user interface device may implement or execute one or moreapplications to manage or control the image capture device 100. Forexample, the user interface device may include an application forcontrolling camera configuration, video acquisition, video display, orany other configurable or controllable aspect of the image capturedevice 100.

The user interface device, such as via an application, may generate andshare, such as via a cloud-based or social media service, one or moreimages, or short video clips, such as in response to user input. In someimplementations, the user interface device, such as via an application,may remotely control the image capture device 100, such as in responseto user input.

The user interface device, such as via an application, may displayunprocessed or minimally processed images or video captured by the imagecapture device 100 contemporaneously with capturing the images or videoby the image capture device 100, such as for shot framing, which may bereferred to herein as a live preview, and which may be performed inresponse to user input. In some implementations, the user interfacedevice, such as via an application, may mark one or more key momentscontemporaneously with capturing the images or video by the imagecapture device 100, such as with a tag, such as in response to userinput.

The user interface device, such as via an application, may display, orotherwise present, marks or tags associated with images or video, suchas in response to user input. For example, marks may be presented in acamera roll application for location review and/or playback of videohighlights.

The user interface device, such as via an application, may wirelesslycontrol camera software, hardware, or both. For example, the userinterface device may include a web-based graphical interface accessibleby a user for selecting a live or previously recorded video stream fromthe image capture device 100 for display on the user interface device.

The user interface device may receive information indicating a usersetting, such as an image resolution setting (e.g., 3840 pixels by 2160pixels), a frame rate setting (e.g., 60 frames per second (fps)), alocation setting, and/or a context setting, which may indicate anactivity, such as mountain biking, in response to user input, and maycommunicate the settings, or related information, to the image capturedevice 100.

FIGS. 2A-B illustrate another example of an image capture device 200.The image capture device 200 includes a body 202 and two camera lenses204, 206 disposed on opposing surfaces of the body 202, for example, ina back-to-back or Janus configuration. Although generally depicted as acamera, it should be appreciated that the particular configuration ofthe image capture device 200 may be varied in alternate embodiments ofthe disclosure. For example, it is envisioned that the image capturedevice 200 may instead take the form of a cell phone.

The image capture device may include electronics (e.g., imagingelectronics, power electronics, etc.) internal to the body 202 forcapturing images via the lenses 204, 206 and/or performing otherfunctions. The image capture device may include various indicators, suchas an LED light 212 and an LCD display 214.

The image capture device 200 may include various input mechanisms, suchas buttons, switches, and touchscreen mechanisms. For example, the imagecapture device 200 may include buttons 216 configured to allow a user ofthe image capture device 200 to interact with the image capture device200, to turn the image capture device 200 on, and to otherwise configurethe operating mode of the image capture device 200. In animplementation, the image capture device 200 includes a shutter buttonand a mode button. It should be appreciated, however, that, in alternateembodiments, the image capture device 200 may include additional buttonsto support and/or control additional functionality.

The image capture device 200 may also include one or more microphones218 configured to receive and record audio signals (e.g., voice or otheraudio commands) in conjunction with recording video.

The image capture device 200 may include an I/O interface 220 and aninteractive display 222 that allows for interaction with the imagecapture device 200 while simultaneously displaying information on asurface of the image capture device 200.

The image capture device 200 may be made of a rigid material such asplastic, aluminum, steel, or fiberglass. In some embodiments, the imagecapture device 200 described herein includes features other than thosedescribed. For example, instead of the I/O interface 220 and theinteractive display 222, the image capture device 200 may includeadditional interfaces or different interface features. For example, theimage capture device 200 may include additional buttons or differentinterface features, such as interchangeable lenses, cold shoes and hotshoes that can add functional features to the image capture device 200,etc.

FIG. 2C is a cross-sectional view of an optical module 223 of the imagecapture device 200 of FIGS. 2A-B. The optical module 223 facilitates thecapture of spherical images, and, accordingly, includes a first imagecapture device 224 and a second image capture device 226. The firstimage capture device 224 defines a first field-of-view 228, as shown inFIG. 2C, and includes a first integrated sensor-lens assembly (ISLA) 229that receives and directs light onto a first image sensor 230 via thelens 204. Similarly, the second image capture device 226 defines asecond field-of-view 232, as shown in FIG. 2C, and includes a secondISLA 233 that receives and directs light onto a second image sensor 234via the lens 206. To facilitate the capture of spherical images, theimage capture devices 224, 226 (and related components) may be arrangedin a back-to-back (Janus) configuration such that the lenses 204, 206face in generally opposite directions.

The fields-of-view 228, 232 of the lenses 204, 206 are shown above andbelow boundaries 236, 238, respectively. Behind the first lens 204, thefirst image sensor 230 may capture a first hyper-hemispherical imageplane from light entering the first lens 204, and behind the second lens206, the second image sensor 234 may capture a secondhyper-hemispherical image plane from light entering the second lens 206.

One or more areas, such as blind spots 240, 242, may be outside of thefields-of-view 228, 232 of the lenses 204, 206 so as to define a “deadzone.” In the dead zone, light may be obscured from the lenses 204, 206and the corresponding image sensors 230, 234, and content in the blindspots 240, 242 may be omitted from capture. In some implementations, theimage capture devices 224, 226 may be configured to minimize the blindspots 240, 242.

The fields-of-view 228, 232 may overlap. Stitch points 244, 246,proximal to the image capture device 200, at which the fields-of-view228, 232 overlap may be referred to herein as overlap points or stitchpoints. Content captured by the respective lenses 204, 206, distal tothe stitch points 244, 246, may overlap.

Images contemporaneously captured by the respective image sensors 230,234 may be combined to form a combined image. Combining the respectiveimages may include correlating the overlapping regions captured by therespective image sensors 230, 234, aligning the captured fields-of-view228, 232, and stitching the images together to form a cohesive combinedimage.

A slight change in the alignment, such as position and/or tilt, of thelenses 204, 206, the image sensors 230, 234, or both, may change therelative positions of their respective fields-of-view 228, 232 and thelocations of the stitch points 244, 246. A change in alignment mayaffect the size of the blind spots 240, 242, which may include changingthe size of the blind spots 240, 242 unequally.

Incomplete or inaccurate information indicating the alignment of theimage capture devices 224, 226, such as the locations of the stitchpoints 244, 246, may decrease the accuracy, efficiency, or both ofgenerating a combined image. In some implementations, the image capturedevice 200 may maintain information indicating the location andorientation of the lenses 204, 206 and the image sensors 230, 234 suchthat the fields-of-view 228, 232, the stitch points 244, 246, or bothmay be accurately determined, which may improve the accuracy,efficiency, or both of generating a combined image.

The lenses 204, 206 may be laterally offset from each other, may beoff-center from a central axis of the image capture device 200, or maybe laterally offset and off-center from the central axis. As compared toimage capture devices with back-to-back lenses, such as lenses alignedalong the same axis, image capture devices including laterally offsetlenses may include substantially reduced thickness relative to thelengths of the lens barrels securing the lenses. For example, theoverall thickness of the image capture device 200 may be close to thelength of a single lens barrel as opposed to twice the length of asingle lens barrel as in a back-to-back configuration. Reducing thelateral distance between the lenses 204, 206 may improve the overlap inthe fields-of-view 228, 232.

Images or frames captured by the image capture devices 224, 226 may becombined, merged, or stitched together to produce a combined image, suchas a spherical or panoramic image, which may be an equirectangularplanar image. In some implementations, generating a combined image mayinclude three-dimensional, or spatiotemporal, noise reduction (3DNR). Insome implementations, pixels along the stitch boundary may be matchedaccurately to minimize boundary discontinuities.

FIGS. 3A-B are block diagrams of examples of image capture systems.

Referring first to FIG. 3A, an image capture system 300 is shown. Theimage capture system 300 includes an image capture device 310 (e.g., acamera or a drone), which may, for example, be the image capture device200 shown in FIGS. 2A-C.

The image capture device 310 includes a processing apparatus 312 that isconfigured to receive a first image from a first image sensor 314 andreceive a second image from a second image sensor 316. The image capturedevice 310 includes a communications interface 318 for transferringimages to other devices. The image capture device 310 includes a userinterface 320 to allow a user to control image capture functions and/orview images. The image capture device 310 includes a battery 322 forpowering the image capture device 310. The components of the imagecapture device 310 may communicate with each other via the bus 324.

The processing apparatus 312 may be configured to perform image signalprocessing (e.g., filtering, tone mapping, stitching, and/or encoding)to generate output images based on image data from the image sensors 314and 316. The processing apparatus 312 may include one or more processorshaving single or multiple processing cores. The processing apparatus 312may include memory, such as a random-access memory (RAM) device, flashmemory, or another suitable type of storage device, such as anon-transitory computer-readable memory. The memory of the processingapparatus 312 may include executable instructions and data that can beaccessed by one or more processors of the processing apparatus 312.

For example, the processing apparatus 312 may include one or moredynamic random access memory (DRAM) modules, such as double data ratesynchronous dynamic random-access memory (DDR SDRAM). In someimplementations, the processing apparatus 312 may include a digitalsignal processor (DSP). In some implementations, the processingapparatus 312 may include an application specific integrated circuit(ASIC). For example, the processing apparatus 312 may include a customimage signal processor.

The first image sensor 314 and the second image sensor 316 may beconfigured to detect light of a certain spectrum (e.g., the visiblespectrum or the infrared spectrum) and convey information constitutingan image as electrical signals (e.g., analog or digital signals). Forexample, the image sensors 314 and 316 may include CCDs or active pixelsensors in a CMOS. The image sensors 314 and 316 may detect lightincident through a respective lens (e.g., a fisheye lens). In someimplementations, the image sensors 314 and 316 include digital-to-analogconverters. In some implementations, the image sensors 314 and 316 areheld in a fixed orientation with respective fields-of-view that overlap.

The communications interface 318 may enable communications with apersonal computing device (e.g., a smartphone, a tablet, a laptopcomputer, or a desktop computer). For example, the communicationsinterface 318 may be used to receive commands controlling image captureand processing in the image capture device 310. For example, thecommunications interface 318 may be used to transfer image data to apersonal computing device. For example, the communications interface 318may include a wired interface, such as a high-definition multimediainterface (HDMI), a universal serial bus (USB) interface, or a FireWireinterface. For example, the communications interface 318 may include awireless interface, such as a Bluetooth interface, a ZigBee interface,and/or a Wi-Fi interface.

The user interface 320 may include an LCD display for presenting imagesand/or messages to a user. For example, the user interface 320 mayinclude a button or switch enabling a person to manually turn the imagecapture device 310 on and off. For example, the user interface 320 mayinclude a shutter button for snapping pictures.

The battery 322 may power the image capture device 310 and/or itsperipherals. For example, the battery 322 may be charged wirelessly orthrough a micro-USB interface.

The image capture system 300 may be used to implement some or all of thetechniques described in this disclosure.

Referring to FIG. 3B, another image capture system 330 is shown. Theimage capture system 330 includes an image capture device 340 and apersonal computing device 360 that communicate via a communications link350. The image capture device 340 may, for example, be the image capturedevice 100 shown in FIGS. 1A-D. The personal computing device 360 may,for example, be the user interface device described with respect toFIGS. 1A-D.

The image capture device 340 includes an image sensor 342 that isconfigured to capture images. The image capture device 340 includes acommunications interface 344 configured to transfer images via thecommunication link 350 to the personal computing device 360.

The personal computing device 360 includes a processing apparatus 362that is configured to receive, using a communications interface 366,images from the image sensor 342. The processing apparatus 362 may beconfigured to perform image signal processing (e.g., filtering, tonemapping, stitching, and/or encoding) to generate output images based onimage data from the image sensor 342.

The image sensor 342 is configured to detect light of a certain spectrum(e.g., the visible spectrum or the infrared spectrum) and conveyinformation constituting an image as electrical signals (e.g., analog ordigital signals). For example, the image sensor 342 may include CCDs oractive pixel sensors in a CMOS. The image sensor 342 may detect lightincident through a respective lens (e.g., a fisheye lens). In someimplementations, the image sensor 342 includes digital-to-analogconverters. Image signals from the image sensor 342 may be passed toother components of the image capture device 340 via a bus 346.

The communications link 350 may be a wired communications link or awireless communications link. The communications interface 344 and thecommunications interface 366 may enable communications over thecommunications link 350. For example, the communications interface 344and the communications interface 366 may include an HDMI port or otherinterface, a USB port or other interface, a FireWire interface, aBluetooth interface, a ZigBee interface, and/or a Wi-Fi interface. Forexample, the communications interface 344 and the communicationsinterface 366 may be used to transfer image data from the image capturedevice 340 to the personal computing device 360 for image signalprocessing (e.g., filtering, tone mapping, stitching, and/or encoding)to generate output images based on image data from the image sensor 342.

The processing apparatus 362 may include one or more processors havingsingle or multiple processing cores. The processing apparatus 362 mayinclude memory, such as RAM, flash memory, or another suitable type ofstorage device, such as a non-transitory computer-readable memory. Thememory of the processing apparatus 362 may include executableinstructions and data that can be accessed by one or more processors ofthe processing apparatus 362. For example, the processing apparatus 362may include one or more DRAM modules, such as DDR SDRAM.

In some implementations, the processing apparatus 362 may include a DSP.In some implementations, the processing apparatus 362 may include anintegrated circuit, for example, an ASIC. For example, the processingapparatus 362 may include a custom image signal processor. Theprocessing apparatus 362 may exchange data (e.g., image data) with othercomponents of the personal computing device 360 via a bus 368.

The personal computing device 360 may include a user interface 364. Forexample, the user interface 364 may include a touchscreen display forpresenting images and/or messages to a user and receiving commands froma user. For example, the user interface 364 may include a button orswitch enabling a person to manually turn the personal computing device360 on and off In some implementations, commands (e.g., start recordingvideo, stop recording video, or capture photo) received via the userinterface 364 may be passed on to the image capture device 340 via thecommunications link 350.

The image capture system 330 may be used to implement some or all of thetechniques described in this disclosure.

With reference now to FIGS. 4-7, the aforementioned optical module 223and ISLAs 229, 233 (seen in FIG. 2) will be discussed in additionaldetail. The optical module 223 includes (first and second) heat sinks448, 450 that are connected, either directly or indirectly, to variouscomponents of the image capture device 200. FIGS. 4 and 5 are respectivefront and rear perspective views of the optical module 223, and FIGS. 6and 7 are respective front and rear perspective views of the opticalmodule 223 with the heat sink 450 removed. In the illustratedembodiment, for example, the heat sink 448 is connected to the ISLAs229, 233, and the heat sink 450 is connected to other supportivecomponents of the image capture device 200 (e.g., the aforementionedprocessing apparatus 312 (FIG. 3A). The heat sinks 448, 450 may include(e.g., may be formed partially or entirely from) any material orcombination of materials that is suitable for the intended purpose ofdissipating heat, such as, for example, aluminum. In the embodiment ofthe disclosure seen in FIGS. 4-7, the heat sinks 448, 450 are positionedso as to define a cavity 452 (FIG. 5) therebetween that is configured toreceive a power source 454 for the image capture device 200 (e.g., theaforementioned battery 322 (FIG. 3A)). It should be appreciated,however, that the particular configuration and/or orientation of theheat sinks 448, 450 may be varied in alternate embodiments of thedisclosure.

The first ISLA 229 includes a substrate 456 (FIG. 5) (e.g., a printedcircuit board (PCB) 458) that supports an electrical assembly 460, andthe second ISLA 233 includes a substrate 462 (FIG. 4) (e.g., a PCB 464)that supports an electrical assembly 466 (FIG. 6). The electricalassemblies 460, 466 include the image sensors 230, 234 (FIGS. 6, 7),respectively, and may also include one or more additional electricalcomponents. For example, the electrical assemblies 460, 466 may includeprocessors 468, 470 (FIGS. 5-7), which may be supported by (or adjacentto) the image sensors 230, 234, respectively, as well as wiring,flexible printed circuits, etc. Although generally contemplated asincluding a layered construction, it should be appreciated that theparticular configuration of the PCBs 458, 464 may be varied in alternateembodiments of the present disclosure.

The optical module 223 also includes a thermal spreader 472 that extendsbetween the ISLAs 229, 233 (e.g., between the respective image sensors230, 234). The thermal spreader 472 is configured to transfer heatbetween the ISLAs 229, 233 (from one of the ISLAs 229, 233 to theother), and, thus, physically and thermally connects the ISLAs 229, 233.As such, the thermal spreader 472 may also be referred to herein as abridge (and/or a thermal bridge).

The thermal spreader 472 may include (e.g., may be formed partially orentirely from) any material or combination of materials that is suitablefor the intended purpose of transferring heat between the ISLAs 229,233. For example, in one particular embodiment, it is envisioned thatthe thermal spreader 472 may include (e.g., may be formed partially orentirely from) graphite. It should be appreciated, however, that the useof other materials would not be beyond the scope of the presentdisclosure. Additionally, although shown as being unitary inconstruction (i.e., as being formed from a single piece of material)throughout the figures, in alternate embodiments of the disclosure, itis envisioned that the thermal spreader 472 may include a series ofindividual segments that are connected to each other during manufactureor assembly of the optical module 223.

The thermal spreader 472 defines a maximum width W (FIG. 6) and amaximum thickness T. While it is generally envisioned that the width Wmay lie substantially within the range of approximately 15 mm toapproximately 25 mm (e.g., 19.6 mm), and that the thickness T may liesubstantially within the range of approximately 0.05 mm to 0.1 mm (e.g.,0.064 mm), it should be appreciated that widths W and/or thicknesses Toutside of these ranges would not be beyond the scope of the presentdisclosure. In certain embodiments, it is envisioned that the thicknessT of the thermal spreader 472 may be varied and/or customized bystacking multiple layers of material (e.g., via the use of a thermaladhesive, or any other suitable connector) such that the thermalspreader 472 includes a laminated construction.

It is envisioned that the width W of the thermal spreader 472 may benon-uniform. For example, the thermal spreader 472 may include one ormore areas of reduced width, and/or one or more notches (cutouts) 474(FIGS. 6, 7) (e.g., to accommodate other components of the opticalmodule 223 or the image capture device 200, such as wiring, connectors,fasteners, flexible printed circuits, etc.). In alternate embodiments ofthe disclosure, however, it is envisioned that the width W of thethermal spreader 472 may be generally uniform.

The thermal spreader 472 includes opposite (first and second) endportions 476, 478 (FIGS. 6, 7), and an intermediate portion 480 thatextends between the end portions 476, 478. As seen in FIGS. 6 and 7, theend portions 476, 478 are connected to the heat sink 448, and theintermediate portion 480 is connected to the ISLAs 229, 233 (e.g., tothe respective substrates 456, 462). It is envisioned that the thermalspreader 472 may be connected to the heat sink 448 and to the ISLAs 229,233 in any suitable manner, such as, for example, through the use of athermal adhesive.

The thermal spreader 472 includes a non-linear, tortuous configurationthat allows the thermal spreader 472 to extend between, and connect, theISLAs 229, 233 and the heat sink 448. More specifically, in theillustrated embodiment, the thermal spreader 472 includes a series ofelbows (bends) 482 that facilitate changes in direction and orientationto allow for connection of the ISLAs 229, 233 and the heat sink 448 inthe manner described herein. For example, in the illustrated embodiment,the thermal spreader 472 includes (first to seventh) elbows 482 i-482vii, wherein the elbows 482 ii, 482 iii are positioned adjacent to theISLA 229, the elbows 482 iv, 482 v are positioned between the ISLAs 229,233, whereby the intermediate portion 480 of the thermal spreader 472extends (at least partially) in transverse relation to the ISLAs 229,233 (e.g., to the image sensors 230, 234), and the elbows 482 vi, 482vii are positioned adjacent to the ISLA 233. It should be appreciated,however, that the particular configuration and/or orientation of thethermal spreader 472 may be varied in alternate embodiments of thedisclosure (e.g., dependent upon spatial requirements, the configurationof the ISLAs 229, 233, etc.). Accordingly, embodiments including greaterand fewer numbers of elbows 482 would not be beyond the scope of thepresent disclosure.

As mentioned above, the thermal spreader 472 allows for improvedmanagement of the heat generated (e.g., by the ISLAs 229, 233) duringuse of the image capture device 200. For example, in certainembodiments, it is envisioned that the image capture device 200 may beoperable in a first (spherical) mode, in which both of the ISLAs 229,233 are active, or a second (standard) mode, in which only one of theISLAs 229, 233 is active (e.g., the ISLA 229), the election of which maybe made via the LCD display 214, the buttons 216, the interactivedisplay 222, or via input in any other suitable manner. During operationin the second mode, the inactive ISLA (e.g., the ISLA 233 in the presentexample) may be used as a supplemental heat sink such that heat istransferrable away from the active ISLA 229 in a first direction(identified by the arrow 1 in FIG. 6) to the heat sink 448, and in asecond direction (identified by the arrow 2) to the inactive ISLA 233,and, ultimately, to the heat sink 448. Utilizing the inactive ISLA 233as an additional heat sink allows for greater heat dissipation, and,thus, slows the rate at which the temperature of the ISLA 229 rises,which may be particularly advantageous during the capture of higher(e.g., 4 k) resolution images and/or video, the resolution of which mayagain be elected using the LCD display 214, the buttons 216, theinteractive display 222, or via input in any other suitable manner.Slowing the rate at which the active ISLA 229 is heated may not onlyallow for increased run time of the image capture device 200, but mayalso increase the usable life of the various components of the opticalmodule 223 and the image capture device 200.

FIGS. 8 and 9 illustrate front and rear perspective views of analternate embodiment of the disclosure in which the ISLAs 229, 233include conductive overlays 890, 892, respectively, to increase thermalconductivity of the ISLAs 229, 233. It is envisioned that the conductiveoverlays 890, 892 may include (e.g., may be formed from) any material orcombination of materials that is suitable for the intended purpose oftransferring heat away from the ISLAs 229, 233 (e.g., away from therespective image sensors 230, 234). For example, in one particularembodiment, it is envisioned that the conductive overlays 890, 892 mayinclude (e.g., may be formed partially or entirely from) copper. Whilethe ISLAs 229, 233 are each illustrated as including respective overlays890, 892, in alternate embodiments of the disclosure, it is envisionedthat one of the overlays 890, 892 may be omitted.

The conductive overlays 890, 892 are secured to the substrates 456, 462,and are configured in correspondence therewith (i.e., such that theshape and size of the overlay 890 is substantially similar (oridentical) to the substrate 456, and the shape and size of the overlay892 is substantially similar (or identical) to the substrate 462). Asseen in FIGS. 8 and 9, the overlays 890, 892 are positioned between therespective substrates 456, 462 and the thermal spreader 472, and may beconnected thereto in any suitable manner, such as, for example, viawelding, or through the use of a thermal adhesive. By connecting thethermal spreader 472 to the overlays 890, 892, rather than directly tothe substrates 456, 462 (as discussed above in connection with FIGS.4-7) or the image sensors 230, 234, heat can be transferred from thesubstrates 456, 462, through the respective overlays 890, 892, to thethermal spreader 472 for conduction to the heat sink 448 in the mannerdiscussed above.

As seen in FIGS. 8 and 9, in certain embodiments, it is envisioned thatthe respective overlays 890, 892 may be directly connected to thesubstrates 456, 462. FIG. 10, however, illustrates an alternateembodiment of the disclosure in which the ISLAs 229, 233 includeintervening members 894, 896 that are positioned between the overlays890, 892 and the respective substrates 456, 462. The intervening members894, 896 are configured and adapted to reduce (if not entirelyeliminate) air gaps between the overlays 890, 892 and the respectivesubstrates 456, 462, thereby increasing thermal conductivity of theISLAs 229, 233. In the particular embodiment seen in FIG. 10, forexample, the intervening members 894, 896 are illustrated as includingthermal padding 898. It should be appreciated, however, that theconfiguration and/or construction of the intervening members 894, 896may be altered in various embodiments without departing from the scopeof the present disclosure. For example, it is envisioned instead thatthe intervening members 894, 896 may take the form of a thermal gel.

FIG. 11 is a rear, perspective view of another embodiment of thedisclosure including a thermal spreader 1000. The thermal spreader 1000is substantially similar to the thermal spreader 472 (FIGS. 4-7)discussed above, and, accordingly, in the interest of brevity, will bedescribed only with respect to any differences therefrom.

In contrast to the thermal spreader 472, which is formed as a singlestructure, the thermal spreader 1000 includes a first thermal bridge1002 that extends between the substrate 456 and the heat sink 448, and asecond thermal bridge 1004 that extends between the substrate 462 andthe heat sink 448. Although illustrated as being identical inconfiguration, it should be appreciated that the thermal bridges 1002,1004 may be dissimilar in alternate embodiments of the disclosure (e.g.,depending upon spatial requirements, necessary or desired heat transferfor the ISLAs 229, 233, etc.).

The thermal bridge 1002 defines a maximum width Wi and a maximumthickness Ti, and the thermal bridge 1004 defines a maximum width Wiiand a maximum thickness Tii. For example, it is envisioned that thewidths Wi, Wii may lie substantially within the range of approximately 5mm to approximately 25 mm (e.g., 9.8 mm to 19.6 mm), and that thethicknesses Ti, Tii may lie substantially within the range ofapproximately 0.025 mm to 0.1 mm (e.g., 0.032 mm to 0.064 mm), althoughwidths Wi, Wii and/or thicknesses Ti, Tii outside of these ranges wouldnot be beyond the scope of the present disclosure. As discussed above inconnection with the thermal spreader 472 (FIGS. 4-7), it is envisionedthat the widths Wi, Wii may be non-uniform (e.g., to accommodate othercomponents of the optical module 223 or the image capture device 200),and/or that the thermal bridges 1002, 1004 may include one or more areasof reduced width.

FIG. 12 is a rear, perspective view of another embodiment of thedisclosure in which the ISLAs 229, 233 include the aforementionedoverlays 890, 892, and the thermal bridges 1002, 1004 are respectivelyconnected thereto. More specifically, the thermal bridge 1002 includes afirst end portion 1006 that is connected to the conductive overlay 890,and a second end portion 1008 that is connected to the heat sink 448,and the thermal bridge 1004 includes a first end portion 1010 that isconnected to the conductive overlay 892, and a second end portion 1012that is connected to the heat sink 448.

Referring now to FIGS. 4-12, by varying the configuration of the ISLAs229, 233 and the presently disclosed thermal spreaders (e.g., thethermal spreader 472 (seen in FIGS. 4-10) and the thermal spreader 1000(seen in FIGS. 11 and 12), significant variation and improvement in therun time of the image capture device 200 is achievable. In a baselineassembly including the thermal bridges 1002, 1004 (FIG. 11), in whicheach of the thermal bridges 1002, 1004 has a width W of 9.8 mm and athickness T of 0.032 mm, a run time of approximately 7.7 minutes wasachievable before reaching a threshold temperature of 75° C. for theISLAs 229, 233 and a threshold temperature of 52° C. for the battery 322(FIG. 3A). However, increasing the width W of each of the thermalbridges 1002, 1004 to 19.6 mm (using the baseline thickness T of 0.032mm) results in an increased run time of 11.4 minutes before reaching thethreshold temperatures of 75° C. and 52° C. for the ISLAs 229, 233 andthe battery 322, respectively, and increasing the thickness T of each ofthe thermal bridges 1002, 1004 to 0.064 mm (using the baseline width Wof 9.8 mm) results in an increased run time of 11.3 minutes beforereaching the threshold temperatures of 75° C. and 52° C. Increasing thewidth W of each of the thermal bridges 1002, 1004 to 19.6 mm and thethickness T of each of the thermal bridges 1002, 1004 to 0.064 mmfurther increases the run time to 14.8 minutes before reaching thethreshold temperatures of 75° C. and 52° C.

In an alternate assembly, using the baseline width W of 9.8 mm and thebaseline thickness T of 0.032 mm, the run time can be increased from 7.7minutes to 12.6 minutes by incorporating the overlays 890, 892 (FIG. 12)and the thermal padding 898.

Increases in run time are also achievable by replacing the thermalbridges 1002, 1004 with the thermal spreader 472 (seen in FIGS. 4-7).For example, using the baseline width W of 9.8 mm and the baselinethickness T of 0.032 mm for the thermal spreader 472, the run time isincreased from 7.7 minutes to 12.6 minutes before reaching the thresholdtemperatures of 75° C. and 52° C. for the ISLAs 229, 233 and the battery322, respectively. However, increasing the thickness T of the thermalspreader 472 to 0.064 mm (using the baseline width W of 9.8 mm) resultsin an increased run time of 16.3 minutes before reaching the thresholdtemperatures of 75° C. and 52° C., and increasing the width W to 19.6 mmin combination with the increased thickness T of 0.064 mm results in anincreased run time of 18.7 minutes.

In another assembly, using the baseline width W of 9.8 mm and thebaseline thickness T of 0.032 mm for the thermal spreader 472, the runtime can be increased from 7.7 minutes to 16.3 minutes by incorporatingthe overlays 890, 892 (FIGS. 8, 9) and the thermal padding 898 (FIG.10).

While the disclosure has been described in connection with certainembodiments, it is to be understood that the disclosure is not to belimited to the disclosed embodiments but, on the contrary, is intendedto cover various modifications and equivalent arrangements includedwithin the scope of the appended claims, which scope is to be accordedthe broadest interpretation as is permitted under the law so as toencompass all such modifications and equivalent arrangements.

Persons skilled in the art will understand that the various embodimentsof the disclosure described herein and shown in the accompanying figuresconstitute non-limiting examples, and that additional components andfeatures may be added to any of the embodiments discussed hereinabovewithout departing from the scope of the present disclosure.Additionally, persons skilled in the art will understand that theelements and features shown or described in connection with oneembodiment may be combined with those of another embodiment withoutdeparting from the scope of the present disclosure to achieve anydesired result, and will appreciate further features and advantages ofthe presently disclosed subject matter based on the descriptionprovided. Variations, combinations, and/or modifications to any of theembodiments and/or features of the embodiments described herein that arewithin the abilities of a person having ordinary skill in the art arealso within the scope of the disclosure, as are alternative embodimentsthat may result from combining, integrating, and/or omitting featuresfrom any of the disclosed embodiments.

Use of the term “optionally” with respect to any element of a claimmeans that the element may be included or omitted, with bothalternatives being within the scope of the claim. Additionally, use ofbroader terms such as “comprises,” “includes,” and “having” should beunderstood to provide support for narrower terms such as “consistingof,” “consisting essentially of,” and “comprised substantially of.”Accordingly, the scope of protection is not limited by the descriptionset out above but is defined by the claims that follow and includes allequivalents of the subject matter of the claims.

In the preceding description, reference may be made to the spatialrelationship between the various structures illustrated in theaccompanying drawings, and to the spatial orientation of the structures.However, as will be recognized by those skilled in the art after acomplete reading of this disclosure, the structures described herein maybe positioned and oriented in any manner suitable for their intendedpurpose. Thus, the use of terms such as “above,” “below,” “upper,”“lower,” “inner,” “outer,” “left,” “right,” “upward,” “downward,”“inward,” “outward,” etc., should be understood to describe a relativerelationship between the structures and/or a spatial orientation of thestructures. Those skilled in the art will also recognize that the use ofsuch terms may be provided in the context of the illustrations providedby the corresponding figure(s).

Additionally, terms such as “approximately,” “generally,”“substantially,” and the like should be understood to allow forvariations in any numerical range or concept with which they areassociated. For example, it is intended that the use of terms such as“approximately” and “generally” should be understood to encompassvariations on the order of 25%, or to allow for manufacturing tolerancesand/or deviations in design.

Each and every claim is incorporated as further disclosure into thespecification and represents embodiments of the present disclosure.Also, the phrases “at least one of A, B, and C” and “A and/or B and/orC” should each be interpreted to include only A, only B, only C, or anycombination of A, B, and C.

1-20. (canceled)
 21. A device comprising: a body; a first image capturedevice supported within the body and including: a first integratedsensor-lens assembly (ISLA) with a first image sensor; and a first lensfacing in a first direction and positioned to receive and direct lightonto the first image sensor; a second image capture device supportedwithin the body and including: a second ISLA with a second image sensor;and a second lens facing in a second direction generally opposite to thefirst direction and positioned to receive and direct light onto thesecond image sensor; and a thermal member located between the firstimage capture device and the second image capture device and configuredto transfer heat away from the first image capture device and the secondimage capture device, the thermal member including a non-linear,bendable configuration.
 22. The device of claim 21, wherein the firstimage capture device defines a first field-of-view and the second imagecapture device defines a second field-of-view overlapping the firstfield-of-view.
 23. The device of claim 21, wherein the device isconfigured for operation in a first mode, in which the first imagesensor and the second image sensor are each active such that images arecapturable by each of the first image capture device and the secondimage capture device, and a second mode, in which only one of the firstimage sensor and the second image sensor is active such that images arecapturable by only one of the first image capture device and the secondimage capture device.
 24. The device of claim 21, wherein the thermalmember includes bends located between opposing end portions thereof. 25.The device of claim 21, wherein the thermal member is unitary inconstruction.
 26. The device of claim 21, wherein the thermal member isnon-unitary in construction.
 27. The device of claim 26, wherein thethermal member includes individual segments connected to each other. 28.The device of claim 21, further comprising a heat sink, the thermalmember being connected to the heat sink.
 29. The device of claim 21,wherein the thermal member extends between the first image capturedevice and the second image capture device.
 30. The device of claim 21,wherein the first ISLA further includes a first printed circuit boardhaving a first conductive overlay and the second ISLA further includes asecond printed circuit board having a second conductive overlay.
 31. Adevice comprising: a body; and an optical module supported within thebody, the optical module including: a heat sink; and a bendable thermalmember operatively connected to the heat sink to facilitate heatdissipation during operation of the optical module.
 32. The device ofclaim 31, wherein the optical module includes a first integratedsensor-lens assembly (ISA) and a second ISLA arranged in a back-to-backconfiguration.
 33. The device of claim 32, wherein the bendable thermalmember is configured to draw heat away from the first ISLA and thesecond ISLA.
 34. The device of claim 31, wherein the bendable thermalmember is non-linear in configuration.
 35. The device of claim 31,wherein the bendable thermal member is unitary in construction.
 36. Anoptical module for an image capture device, the optical modulecomprising: a first integrated sensor-lens assembly (ISLA) including afirst image sensor and a first lens; a second ISLA including a secondimage sensor and a second lens; a heat sink located between the firstISLA and the second ISLA; and a thermal member including a non-linearconfiguration connected to the heat sink to facilitate heat dissipationduring operation of the optical module.
 37. The optical module of claim36, wherein the thermal member includes bends located between opposingend portions thereof.
 38. The optical module of claim 36, wherein thefirst ISLA and the second ISLA define overlapping fields-of-view and areconfigured to capture individual images and/or spherical images.
 39. Theoptical module of claim 36, wherein the thermal member is non-unitary inconstruction.
 40. The optical module of claim 39, wherein the thermalmember includes a first portion extending between the heat sink and thefirst ISLA and a second portion extending between the heat sink and thesecond ISLA.